SEMICON Europa 2026 highlights advanced packaging and AI

SEMICON Europa 2026 will bring together semiconductor industry leaders in Munich, Germany, from November 10-13 to explore how advanced packaging, AI-driven manufacturing and cross-border collaboration can strengthen Europe’s chip industry. Held at Messe München alongside electronica, the event will focus on technologies and investment strategies needed to improve Europe’s competitiveness and semiconductor supply chain resilience. For European chipmakers, equipment suppliers and technology developers, the discussions will offer insights into emerging manufacturing opportunities, industrial scaling challenges and the future direction of Europe’s semiconductor strategy. Advanced packaging takes center stage The Advanced Packaging Conference (APC) will examine how heterogeneous integration, chiplets and next-generation packaging technologies can deliver performance improvements as conventional semiconductor scaling becomes increasingly challenging. Key topics include wafer- and panel-level packaging, hybrid bonding, silicon photonics, co-packaged optics and thermal management. AI-powered inspection, advanced metrology and testing will also feature, alongside Europe’s growing packaging ecosystem and pilot-line activities. “As Europe navigates an increasingly complex geopolitical and technological landscape, advanced packaging is becoming a strategic pillar of semiconductor supply chain resilience,” said Laith Altimime, President of SEMI Europe. The conference will also explore the challenges of moving advanced packaging innovations from research into high-volume manufacturing, an increasingly important issue for Europe’s semiconductor ambitions. AI and automation reshape fab management The Fab Management Forum, scheduled for November 11, will focus on improving semiconductor manufacturing productivity, resilience and sustainability. Discussions will cover AI-driven factory automation, progress toward autonomous fabs and the impact of geopolitical and market developments on European manufacturing capacity. Emerging opportunities in silicon carbide, wide-bandgap semiconductors, photonics and advanced foundry services will also be examined. Europe’s semiconductor ecosystem in focus The event’s Voices from the Industry program will broaden the discussion to semiconductor security, supply chains and regional cooperation. The co-located imec Technology Forum will address emerging chiplet architectures, sustainable manufacturing and the policy frameworks supporting Europe’s AI ecosystem. Other sessions will explore secure-by-design computing through the CHERI Alliance, agentic AI for semiconductor supply chain management, and advanced packaging industrialization. CEA-Leti will showcase innovations in 3D integration, silicon photonics and energy-efficient AI hardware, while representatives from the Baltic Sea region will discuss opportunities for building a more resilient European semiconductor corridor. The program will also highlight transatlantic collaboration opportunities, including Arizona’s expanding semiconductor manufacturing ecosystem. The post SEMICON Europa 2026 puts advanced packaging and AI in focus appeared first on eeNews Europe.